詳細(xì)介紹

詳細(xì)參數(shù)

無鉛回流焊采用Windows 7系統(tǒng)，中英文界面在綫任意切換，操作簡便；

西門子PLC+模塊化控制，性能穩(wěn)定可靠，重復(fù)精度更高：

回流焊采用雙溫度傳感器，雙安全控制模式，系統(tǒng)異常會(huì)自動(dòng)切斷加熱電源；

采用上下獨(dú)立溫控和風(fēng)速可設(shè)計(jì)，滿足各種高精度無鉛焊接工藝要求；

新型爐膛設(shè)計(jì)有效地縮小了大小元件之間的溫差，確保焊點(diǎn)可靠性的同時(shí)，消除了對(duì)元件熱損傷的隱患；

階段式強(qiáng)制冷卻系統(tǒng)輕易地實(shí)現(xiàn)各類無鉛錫膏的冷卻速率要求（30/秒）：

回流焊爐可配 支撐和雙導(dǎo)軌。

Windows 7 system, in the English and Chinese interface online arbitrary switch, easy to operate;

SIEMENS PLC+ modular control, stable and reliable performance, higher accuracy:

Double temperature sensor, double safety control mode, the system will automatically cut off the heating power supply;

The upper and lower temperature and wind speed can be designed to meet the requirements of various high precision lead free soldering process;

The new furnace design effectively reduces the temperature difference between the size of the components, to ensure the reliability of the solder joints, the elimination of heat damage to the component;

Stage type forced cooling system to easily achieve the cooling rate all kinds of lead-free solder paste requirements (less than 30 DEG C / s):

Reflow soldering can be equipped with central support and dual rail.